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MAB
Advanced Gate Stacks for High-Mobility Semiconductors
Kategorie
Beschreibung
036a
XA-DE
037b
eng
077a
277080878 Buchausg. u.d.T.: ‡Advanced gate stacks for high-mobility semiconductors
087q
978-3-540-71490-3
100b
Dimoulas, Athanasios
104b
Gusev, Evgeni
108b
Heyns, Marc
112b
McIntyre, Paul C.
331
Advanced Gate Stacks for High-Mobility Semiconductors
410
Berlin, Heidelberg
412
Springer Berlin Heidelberg
425
2007
425a
2007
433
Online-Ressource (digital)
451
Advanced Microelectronics ; 27
527
Buchausg. u.d.T.: ‡Advanced gate stacks for high-mobility semiconductors
540a
ISBN 978-3-540-71491-0
700
|TEC008070
700
|TJF
700
|TEC008000
700b
|621.381
700c
|TK7800-8360
700c
|TK7874-7874.9
700g
1271560968 ZN 3460
700g
1271498537 ZN 4960
700g
1271495805 UP 4600
750
Strained-Si CMOS Technology -- High Current Drivability MOSFET Fabricated on Si(110) Surface -- Advanced High-Mobility Semiconductor-on-Insulator Materials -- Passivation and Characterization of Germanium Surfaces -- Interface Engineering for High-? Ge MOSFETs -- Effect of Surface Nitridation on the Electrical Characteristics of Germanium High-?/Metal Gate Metal-Oxide-Semiconductor Devices -- Modeling of Growth of High-? Oxides on Semiconductors -- Physical, Chemical, and Electrical Characterization of High-? Dielectrics on Ge and GaAs -- Point Defects in Stacks of High-? Metal Oxides on Ge: Contrast with the Si Case -- High ? Gate Dielectrics for Compound Semiconductors -- Interface Properties of High-? Dielectrics on Germanium -- A Theoretical View on the Dielectric Properties of Crystalline and Amorphous High-? Materials and Films -- Germanium Nanodevices and Technology -- Opportunities and Challenges of Germanium Channel MOSFETs -- Germanium Deep-Submicron p-FET and n-FET Devices, Fabricated on Germanium-On-Insulator Substrates -- Processing and Characterization of III–V Compound Semiconductor MOSFETs Using Atomic Layer Deposited Gate Dielectrics -- Fabrication of MBE High-? MOSFETs in a Standard CMOS Flow.
753
Will nanoelectronic devices continue to scale according to Moore’s law? At this moment, there is no easy answer since gate scaling is rapidly emerging as a serious roadblock for the evolution of CMOS technology. Channel engineering based on high-mobility semiconductor materials (e.g. strained Si, alternative orientation substrates, Ge or III-V compounds) could help overcome the obstacles since they offer performance enhancement. There are several concerns though. Do we know how to make complex engineered substrates (e.g. Germanium-on-Insulator)? Which are the best interface passivation methodologies and (high-k) gate dielectrics on Ge and III-V compounds? Can we process these materials in short channel transistors using flows, toolsets and know how similar to that in Si technology? How do these materials and devices behave at the nanoscale? The reader will get a clear view of what has been done so far, what is the state-of-the-art and which are the main challenges ahead before we come any close to a viable Ge and III-V MOS technology.
902s
209617020 MOS
902s
277967600 High-k-Dielektrikum
902s
209662492 Germanium
902s
20978170X Drei-Fünf-Halbleiter
902f
00000011 Aufsatzsammlung
012
280565909
081
Advanced Gate Stacks for High-Mobility Semiconductors
100
Springer E-Book
125a
Elektronischer Volltext - Campuslizenz
655e
$uhttp://dx.doi.org/10.1007/978-3-540-71491-0
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