| Vorliegende Sprache |
eng |
| ISBN |
978-0-470-16778-6 |
| Name |
Schlesinger, Mordechay |
| Paunovic, Milan |
| Name ANZEIGE DER KETTE |
Paunovic, Milan |
| T I T E L |
Modern electroplating |
| Auflage |
5th ed |
| Verlagsort |
Hoboken, N.J |
| Verlag |
Wiley |
| Erscheinungsjahr |
2010 |
| 2010 |
| Umfang |
1 Online-Ressource (xv, 729 pages) : illustrations |
| Reihe |
The Electrochemical Society series |
| Notiz / Fußnoten |
Includes bibliographical references and index |
| Titelhinweis |
Erscheint auch als (Druck-Ausgabe): Modern electroplating. Hoboken, N.J: Wiley, ©2010 |
| ISBN |
ISBN 0-470-60263-5 electronic bk. |
| ISBN 0-470-60262-7 electronic bk. |
| ISBN 978-0-470-60263-8 electronic bk. |
| ISBN 978-0-470-60262-1 electronic bk. |
| ISBN 0-470-16778-5 |
| ISBN 978-0-470-16778-6 |
| Klassifikation |
TEC 040000 |
| 671.7/32 |
| TS670 |
| Kurzbeschreibung |
"Electroplating is the coating of an electrically conductive object with a layer of metal using electrical current resulting in a thin, smooth, even coat of metal on the object. This text covers the methods and applications of electrochemical deposition of metals, alloys, semiconductors, and conductive polymers. It provides practical advice and some theoretical background to those entering the field of electrodeposition. Like previous editions, the fifth edition will be the first stop reference for the electroplating community. This fully updated edition includes significant advances in the field, from emerging electrodeposition techniques to electroplating in medical and data storage industries"-- |
| 2. Kurzbeschreibung |
Frontmatter -- Fundamental Considerations / Milan Paunovic, Mordechay Schlesinger, Dexter D Snyder -- Electrodeposition of Copper / Jack W Dini, Dexter D Snyder -- Electrodeposition of Nickel / George A Di Bari -- Electrodeposition of Gold / Paul A Kohl -- Electroless and Electrodeposition of Silver / Mordechay Schlesinger -- Tin and Tin Alloys for Lead-Free Solder / Yun Zhang -- Electrodeposition of Chromium / Nenad V Mandich, Donald L Snyder -- Electrodeposition of Lead and Lead Alloys / Manfred Jordan -- Electrodeposition of Tin₆Lead Alloys / Manfred Jordan -- Electrodeposition of Zinc and Zinc Alloys / Reň Winand -- Electrodeposition of Iron and Iron Alloys / Masanobu Izaki -- Palladium Electroplating / Joseph A Abys -- Electrochemical Deposition Process for ULSI Interconnection Devices / Tetsuya Osaka, Masahiro Yoshino -- Electrodeposition of Semiconductors / T E Schlesinger, Krishnan Rajeshwar, Norma R De Tacconi -- Deposition on Nonconductors / Mordechay Schlesinger -- Conductive Polymers: Electroplating of Organic Films / Tetsuya Osaka, Shinichi Komaba, Toshiyuki Momma -- Electroless Deposition of Copper / Milan Paunovic -- Electroless Deposition of Nickel / Mordechay Schlesinger -- Electrochemical Synthesis of Metal Alloys for Magnetic Recording Systems / Atsushi Sugiyama, Masahiro Yoshino, Takuma Hachisu, Tetsuya Osaka -- Electroless Deposition of Palladium and Platinum / Izumi Ohno -- Electroless Deposition of Gold / Yutaka Okinaka, Masaru Kato -- Electroless Deposition of Alloys / Izumi Ohno -- Preparation for Deposition / Dexter D Snyder -- Manufacturing Tools / Tom Ritzdorf -- Monitoring and Control / Tom Ritzdorf -- Environmental Aspects of Electrodeposition / Micha Tomkiewicz -- Applications to Magnetic Recording and Microelectronic Technologies / Stanko R Brankovic, Natasa Vasiljevic, Nikolay Dimitrov -- Microelectromechanical Systems / Giovanni Zangari -- Analysis of Electroplated Films Using Dual-Beam FIB/SEM and TEM Techniques / Xianying Meng-Burany -- Ionic Liquid Treatments for Enhanced Corrosion Resistance of Magnesium-Based Substrates / Robert Petro, Mordechay Schlesinger, Guang-Ling Song -- Appendix -- Index. |
| SWB-Titel-Idn |
167962945X |
| Signatur |
E-Book Wiley |
| Bemerkungen |
Elektronischer Volltext - Campuslizenz |
| Elektronische Adresse |
$uhttps://onlinelibrary.wiley.com/doi/book/10.1002/9780470602638 |
| Internetseite / Link |
Verlag |
