| Vorliegende Sprache |
eng |
| Hinweise auf parallele Ausgaben |
381661334 Buchausg. u.d.T.: ‡Jiang, Guosheng: Advanced thermal management materials |
| ISBN |
978-1-4614-1962-4 |
| Name |
Jiang, Guosheng |
| Diao, Liyong |
| ANZEIGE DER KETTE |
Diao, Liyong |
| Name |
Kuang, Ken |
| T I T E L |
Advanced Thermal Management Materials |
| Verlagsort |
New York, NY |
| Verlag |
Springer |
| Erscheinungsjahr |
2013 |
| 2013 |
| Umfang |
Online-Ressource (digital) |
| Reihe |
SpringerLink. Bücher |
| Notiz / Fußnoten |
Description based upon print version of record |
| Weiterer Inhalt |
Advanced ThermalManagement Materials; Preface; Contents; Chapter 1: Introduction to Thermal Management in Microelectronics Packaging; 1.1 Basics of Thermal Management in Microelectronics Packaging; 1.1.1 Heat Flux; 1.1.2 Thermal Resistance; 1.1.3 Thermal Management Examples with a Heat Sink and Without a Heat Sink; 1.2 Heat Generation and the Purpose of Thermal Management in Microelectronics Packaging; 1.3 Introduction to Electronic Packaging; 1.3.1 Classi fi cation of Electronic Packaging; 1.3.2 Functions of Electronic Packaging; 1.3.2.1 Physical Protection. 1.3.2.2 Power and Signal Distributions1.3.2.3 Cooling Channel; 1.3.2.4 Mechanical Support; 1.4 Development Trends of Electronic Packaging Technology; 1.5 Development Stages of Thermal Management Materials; 1.5.1 Low-power-device Thermal Management Materials; 1.5.2 High-power-device Thermal Management Materials; 1.5.3 Ultra-high-power-device Thermal Management Materials; References; Chapter 2: Requirements of Thermal Management Materials; 2.1 Thermal Conductivity Requirements of Thermal Management Materials; 2.1.1 Heat-Conducting Mechanism. 2.1.1.1 Mechanism of Metal Electron Thermal Conductivity2.1.1.2 Mechanism of Metal Lattice Thermal Conductivity; 2.1.1.3 Other Thermal Conducting Mechanisms; 2.1.2 Factors Affecting Thermal Conductivity; 2.1.3 Methods of Measuring Thermal Conductivity; 2.2 Coef fi cient of Thermal Expansion Requirement of Thermal Management Materials; 2.2.1 De fi nition of Coef fi cient of Thermal Expansion; 2.2.2 Methods for Measuring the Coef fi cient of Thermal Expansion; 2.3 Hermeticity Requirement of Thermal Management Materials; 2.4 Other Performance Requirements of Thermal Management Materials. 2.5 Appearance Quality Requirements of Thermal Management Materials2.5.1 Surface Layer of Nickel and Gold Plating Performance Requirements; 2.5.2 Quality Requirements of Surface Appearance; References; Chapter 3: Overview of Traditional Thermal Management Materials; 3.1 Ceramic Matrix Conventional Thermal Management Materials; 3.1.1 Al 2 O 3 Thermal Management Materials; 3.1.1.1 Thick- fi lm Substrate; 3.1.1.2 Thin- fi lm Circuit Substrate; 3.1.1.3 Multilayer Substrate Integrated Circuits; 3.1.2 BeO Thermal Management Materials; 3.1.3 AlN Thermal Management Materials. 3.1.4 SiC Thermal Management Material3.1.5 Mullite Thermal Management Materials; 3.1.6 Multilayer Co fi red Ceramics; 3.2 Traditional Plastic-based Thermal Management Materials; 3.3 Pure Metal or Alloy Traditional Thermal Management Materials; 3.3.1 Pure Copper and Aluminum Metal Thermal Management Materials; 3.3.2 Refractory Metals Tungsten and Molybdenum as Thermal Management Materials; 3.3.3 Kovar Alloy; 3.3.4 #10 Steel; References; Chapter 4: Development of Advanced Thermal Management Materials; 4.1 Introduction; 4.2 Development of Advanced Thermal Management Materials. 4.3 Particle-enhanced Thermal Management Materials |
| Titelhinweis |
Buchausg. u.d.T.: ‡Jiang, Guosheng: Advanced thermal management materials |
| ISBN |
ISBN 978-1-4614-1963-1 |
| Klassifikation |
TH |
| TEC031000 |
| TEC009020 |
| 620.1696 |
| 621.381046 |
| 658.26 |
| T58.8 |
| Kurzbeschreibung |
Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional, with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions. This book also:Provides an in-depth overview of copper, metal and aluminum materials and discusses the advantages and disadvantages of each in thermal management Discusses numerical simulation methods and techniques used in analysis of electronic devices and materials Covers system and component integration of advanced packaging materialsAdvanced Thermal Management Materials is an ideal book for microelectronics and packaging engineers, scientists and researchers in academia and industry interested in thermal packaging in high performance systems |
| 2. Kurzbeschreibung |
Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions. |
| 1. Schlagwortkette |
Elektronisches Bauelement |
| Temperaturverhalten |
| ANZEIGE DER KETTE |
Elektronisches Bauelement -- Temperaturverhalten |
| 2. Schlagwortkette |
Elektronisches Bauelement |
| Temperaturverhalten |
| ANZEIGE DER KETTE |
Elektronisches Bauelement -- Temperaturverhalten |
| SWB-Titel-Idn |
37349744X |
| Signatur |
Springer E-Book |
| Bemerkungen |
Elektronischer Volltext - Campuslizenz |
| Elektronische Adresse |
$uhttp://dx.doi.org/10.1007/978-1-4614-1963-1 |
| Internetseite / Link |
Volltext |
| Siehe auch |
Volltext |
| Siehe auch |
Cover |
