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¬The¬ ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects

Kataloginformation Katalogdatensatz500161756 .

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Feldname	Details
Vorliegende Sprache	eng
ISBN	978-0-85729-235-3
Name	Grossmann, Günter
Name	Zardini, Christian
Name ANZEIGE DER KETTE	Zardini, Christian
T I T E L	¬The¬ ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Verlagsort	London
Verlag	Springer-Verlag London Limited
Erscheinungsjahr	2011
Erscheinungsjahr	2011
Umfang	Online-Ressource (VIII, 313p. 202 illus., 22 illus. in color, digital)
Reihe	SpringerLink. Bücher
Notiz / Fußnoten	Includes bibliographical references
Weiterer Inhalt	The ELFNET Book on Failure Mechanisms,Testing Methods, and Quality Issues of Lead-Free Solder Interconnects; Contents; List of Contributors; 1 Deformation and Fatigue of Solders; 1.1…Deformation; 1.1.1 Time-Independent Deformation; 1.1.2 Time-Dependent Deformation; 1.2…Degradation Due to Cyclic Load; 1.2.1 Definition of a Cyclic Load; 1.2.2 Fatigue Testing; 1.2.2.1 sigma m Constant, sigma a Varying; 1.2.2.2 sigma m and sigma a Varying; 1.2.3 Brittleness; 1.2.4 Modes of Fatigue; 1.2.4.1 Low-Cycle Fatigue; 1.2.4.2 High-Cycle Fatigue; 1.2.4.3 More than One Degradation Mechanism; References. 2 Factors Affecting the Bulk Embrittlement of Pb-Free Solder Joints2.1…Introduction; 2.1.1 Comparing Ductile to Brittle Fractures; 2.1.2 Factors Affecting the Type of Fracture; 2.2…Crystal Structure, Microstructure, and Fracture Resistance; 2.2.1 Elements of Fracture Mechanics; 2.2.2 Metallurgical Aspects of Fracture Resistance; 2.2.3 Elements of Dislocation Theory; 2.3…Impact Test: Work Principle and Interpretation of Results; 2.3.1 Temperature on Impact Toughness; 2.3.2 Strain Rate on Impact Toughness; 2.3.3 Constraint on Impact Toughness; 2.3.4 Standard ASTM Fracture Test Methods. 2.3.5 Correlation of KIc and KId with CVN Energy2.3.6 Other Impact Testing Considerations; 2.4…Fracture Behaviour of Sn-Based Pb-Free Solders; 2.4.1 Ductile-to-Brittle Transition; 2.4.1.1 CVN Impact Testing of Bulk Solder Samples; 2.4.1.2 Impact Testing of Solder Joints; 2.4.2 Microstructural Aspects of the Ductile-to-Brittle Transition; 2.4.2.1 IMC Size Distribution and Spacing on DBTT; 2.4.2.2 IMC Interaction with Crack Path During Thermal Cycling; 2.4.3 ''Tin Pest''; Acknowledgments; References; 3 Thermal Fatigue Analysis; 3.1…Introduction; 3.2…Fatigue Failure Mechanism. 3.3…Thermal Test Cycling Standards3.3.1 Fatigue Failure Detection; 3.4…Theoretical Modelling of Thermal Fatigue; 3.5…Open Questions; References; 4 Electrochemical Behaviour of Solder Alloys; 4.1…Introduction; 4.2…Experimental; 4.2.1 Test Board; 4.2.2 Test Board Cleaning; 4.2.3 Test Flux; 4.2.4 Test Board Contamination; 4.2.5 Flux Concentration; 4.2.5.1 Electrochemical Impedance (EI) Measurements; 4.2.5.2 Surface Insulation Resistance (SIR) Measurement; 4.2.6 Electrochemical Impedance (EI) Measurement; 4.2.7 Surface Insulation Resistance (SIR) Measurement; 4.2.8 EDX Analysis of Dendrites. 4.3…Results4.3.1 Electrochemical Impedance Spectra on Five Board Finishes; 4.3.2 Surface Insulation Resistance Results; 4.3.3 SEM-EDX Analysis of Dendrites on SIR Boards; 4.4…Discussion; 4.4.1 Ionic Resistance for Different Board Finishes; 4.4.2 Effect of Ionic Resistance on Dendrite Formation; 4.4.3 EI Measurement to Predict Dendrite Formation; 4.5…Conclusions; Acknowledgments; References; 5 Void Formation by Kirkendall Effect in Solder Joints; 5.1…Diffusion; 5.2…Kirkendall Effect; 5.3…Kirkendall Void Formation; 5.4…Kirkendall Voids in Solder Joints; 5.4.1 Diffusion Couple Sn/Cu. 5.4.1.1 Reactions During Soldering: Cu Reactions with Liquid Sn
Titelhinweis	Buchausg. u.d.T.ISBN: 978-0-85729-235-3
ISBN	ISBN 978-0-85729-236-0
Klassifikation	TJF
	TEC008000
	TEC008070
	621.381
	671.56
	TK7800-8360
	TK7874-7874.9
Kurzbeschreibung	The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering.The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for accelerated testing. This has led to a matrix of failure mechanisms and their activation and, as a result, to a comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints.The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is written for scientists, engineers and researchers involved with lead-free electronics.
SWB-Titel-Idn	345801334
Signatur	Springer E-Book
Bemerkungen	Elektronischer Volltext - Campuslizenz
Elektronische Adresse	$uhttp://dx.doi.org/10.1007/978-0-85729-236-0
Internetseite / Link	Volltext
Siehe auch	Volltext
Siehe auch	Cover

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